Horiba Water Quality Analyzer Devision






GLOSS Checker , õ

HORIBA õ ⸦ Ұ մϴ.


 Dual range checker for Gloss and Ultra High Gloss measurement

 The IG-410 measures ultra high gloss surfaces such as polished metal. The meter has ten times greater  measurement range than the conventional model. Even mirror finishes can be measured too.

 Weighing in at only 350g (1.3 lbs), this battery operated instrument is designed to be portable. Fast and  reliable measurement by simple one-touch operation. LED light sources give <100,000 hours service so  there is no need to exchange these parts due to lifetime.

 The IG-410 has two user-selectable measurement ranges, depending on the sample to be measured.  Low gloss samples can be measured using the 0-100 range and high gloss samples can be measured  using the 0-1000 range. Two calibration plates are provided to allow the user to follow a simple  one-touch calibration procedure to ensure reproducible results.



  • Latest model Gloss Checker now checks Ultra high gloss surface finishes

  • Compact, lightweight and detachable probe design

  • Dual range extends measurement resolution in the low gloss range



Measuring system


Measuring area

3 x 6mm oval

Light source (Service life)

LED <890nm> (Indefinite)


SPD <890nm> (Silicon photodiode)

Measuring range


range1 : 0.0 - 100.0 0.1

range2 : 0 - 1000 (1)


±1% F.S.

Power source

(Battery life)

R6 (AA) Alkaline x 4

(200 hours or more at continuous operation)

Ambient temperature range

10 - 40


Main body : 75 (W) x 34 (D) x 140 (H) mm
                 5.5 (W) x 3.0 (D) x 1.3 (H) in
Optical system : 88 (W) x 30 (D) x45 (H))mm
                       3.5 (W) x 1.2 (D) x 1.8 (H) in


Approx. 350g (including battery)

Additional functions

Automatic calibration
Automatic power cut-off
Overrange display
Display hold


Standard plate for range 100, 1000

AA battery (LRb)

Instruction Manual

Lense cloth



  • For external confirmation of plating product.

  • For finish confirmation of rolling metals.

  • For Reseach and Development of wafer polishing devices.



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